Sic Process Engineering - Wafer Surface Grinding M/F

Sic Process Engineering - Wafer Surface Grinding M/F
Azienda:

Stmicroelectronics



Funzione Lavorativa:

Ingegneria

Dettagli della offerta

Job description You will be a key contributor to SiC Technology volume ramp-up in ST. The work location will be in the new mass-production fab in Catania for the manufacturing of SiC substrate wafers, this facility will be a first of its kind in Europe for the production in volume of SiC epitaxial substrates, integrating all steps in the production flow.

Strong link is maintained with STMicroelectronics Silicon Carbide AB, located in Norrköping, Sweden, with opportunities for on-site training and collaboration. STMicroelectronics Silicon Carbide AB, previously named Norstel AB, is the ST competence center in SiC material technology: the company has been developing silicon carbide for 20 years, first at Linköping University, and since 2006 in a dedicated production facility in Norrköping.

Your role will be part of the Wafer Finishing group inside the Process Engineering team.

The focus of the group will be to ensure a smooth transition between the R&D activities and the mass-production fab and to maintain high product quality, defining process flows and recipes, ensuring equipment performances, understanding and exploiting the interactions between different process steps.

KEY RESPONSIBILITIES Lead the process steps transfer from the R&D fab to the High-Volume Manufacturing fab with focus on Wafer Surface Grinding process Hands-on work with processes and tools used in SiC semiconductor technology Conduct systematic troubleshooting of equipment-related problems Implement and refine procedures and qualification plans for bringing new processes on line Qualify new production tools with suppliers and against internal criteria Train new employees (operators, technicians, and engineers) Ensure process robustness and stability by managing equipment control charts, tool alarms, fault detection Support R&D projects Contribute to yield enhancement and process industrialization Profile Both junior and senior profiles will be evaluated, with the following background and characteristics:

Education: PhD or Master in scientific faculty, e.g. in Mechanical Engineering, Material Science, Physics, Chemistry Experience: 2-5 years in silicon processing and flow knowledge is a plus Skills: Precision, attention to details, and good manual skills Language: Fluent English is a must Communication: Good communication skills and able to work in a team Personal Qualities: Committed, Proactive, and Curious Position location: Europe, Italy, Catania

Candidate criteria: Education level required - Master degree, Experience level required - 2-5 years, Languages - English (3-Advanced)



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Risorsa: Jobleads

Funzione Lavorativa:

Requisiti

Sic Process Engineering - Wafer Surface Grinding M/F
Azienda:

Stmicroelectronics



Funzione Lavorativa:

Ingegneria

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