OUR STORY At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today.
When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators & makers of technology around the world!
Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation – whilst unlocking your own potential.
Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way. Our technology starts with you. Join us and start the future!
You will be a key contributor to SiC Technology volume ramp-up in ST. The work location will be in the new mass-production fab in Catania for the manufacturing of SiC substrate wafers, this facility will be a first of a kind in Europe for the production in volume of SiC epitaxial substrates, integrating all steps in the production flow.
Strong link is maintained with STMicroelectronics Silicon Carbide AB, located in Norrköping, Sweden, with opportunities for on-site training and collaboration. STMicroelectronics Silicon Carbide AB, previously named Norstel AB, is the ST competence center in SiC material technology: the company has been developing silicon carbide for 20 years, first at Linköping University, and since 2006 in a dedicated production facility in Norrköping.
You will be part of the Process Engineering team working in Wafer Finishing processes group, as specialist of the Chemical-Mechanical Polishing (CMP) process step.
The focus of the group will be to ensure a smooth transition between the R&D activities and the mass-production fab and to maintain high product quality, defining process flows and recipes, ensuring equipment performances, understanding and exploiting the interactions between different process steps.
KEY RESPONSIBILITIES Lead the process steps transfer from the R&D fab to the High-Volume Manufacturing fab with focus on chemical-mechanical polishing (CMP) process Hands-on work with processes and tools used in SiC semiconductor technology Leading the ramp-up of the new fab through equipment and process qualifications Conduct systematic troubleshooting of equipment-related problems Implement and refine procedures and qualification plans for bringing new processes online Qualify new production tools with suppliers and against internal criteria Train new employees (operators, technicians and engineers) Ensure process robustness and stability by managing equipment control charts, tool alarms, fault detection Support R&D projects Contribute to yield enhancement and process industrialization Candidate profile Both junior and senior profiles will be evaluated, with the following background and characteristics:
PhD or Master in scientific faculty, e.g. in Chemistry, Engineering, Material Science, Physics Experience in silicon processing and flow knowledge is a plus Precision, attention to details and good manual skills Fluent English is a must Good communication skills and able to work in a team Committed, Proactive and Curious We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Our DEI vision is, "At ST, you can be the true version of yourself", we value all employee contributions and have zero tolerance for any kind of discrimination.
Joining us is also about a greater work-life balance and workplace with equal opportunities. Dedicated Employee Resource Groups for women and LGBTQIA+, hybrid work arrangements are amongst the many DEI & Sustainability initiatives that make us a great place to evolve your career.
To discover more, visit st.com/careers
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