Shift Process Engineering - SiC Grinding & Slicing M/F EUR 50.000 - 70.000 Job description You will be a key contributor to SiC Technology volume ramp-up in ST. The work location will be in the new mass-production fab in Catania for the manufacturing of SiC substrate wafers; this facility will be a first of a kind in Europe for the production in volume of SiC epitaxial substrates, integrating all steps in the production flow. Strong link is maintained with STMicroelectronics Silicon Carbide AB, located in Norrköping, Sweden, with opportunities for on-site training and collaboration. Your main focus will be in the Ingot Grinding and Slicing area, with the following tasks: Hands-on work with processes and tools used in SiC semiconductor technology Conduct systematic troubleshooting of process and equipment-related problems Take decisions in production area in order to assure production continuity and quality Train new employees (operators and technicians) Ensure process robustness and stability by managing equipment control charts, tool alarms, fault detection Support R&D projects Contribute to yield enhancement and process industrialization Profile Both junior and senior profiles will be evaluated, with the following background and characteristics: Experience with Computerized Numerical Control (CNC) machines (usage and troubleshooting) is desired Experience in semiconductor processing and flow knowledge is a plus Excellent manual skills, precision, and attention to details Good English language skills are desired Good communicator, able to create good relationships and work harmoniously with people Committed, persistent, and curious Availability to work on shifts Position location Job location: Europe, Italy, Catania Education level required: 3 - Upper secondary education diploma Experience level required: Less than 2 years Languages: Italian (3 - Advanced) English (1 - Basic) J-18808-Ljbffr