Shift Process Engineering - SiC Grinding & Slicing M/FEUR 50.000 - 70.000
Job description
You will be a key contributor to SiC Technology volume ramp-up in ST. The work location will be in the new mass-production fab in Catania for the manufacturing of SiC substrate wafers; this facility will be a first of a kind in Europe for the production in volume of SiC epitaxial substrates, integrating all steps in the production flow. Strong link is maintained with STMicroelectronics Silicon Carbide AB, located in Norrköping, Sweden, with opportunities for on-site training and collaboration.
Your main focus will be in the Ingot Grinding and Slicing area, with the following tasks: Hands-on work with processes and tools used in SiC semiconductor technologyConduct systematic troubleshooting of process and equipment-related problemsTake decisions in production area in order to assure production continuity and qualityTrain new employees (operators and technicians)Ensure process robustness and stability by managing equipment control charts, tool alarms, fault detectionSupport R&D projectsContribute to yield enhancement and process industrializationProfile
Both junior and senior profiles will be evaluated, with the following background and characteristics:
Experience with Computerized Numerical Control (CNC) machines (usage and troubleshooting) is desiredExperience in semiconductor processing and flow knowledge is a plusExcellent manual skills, precision, and attention to detailsGood English language skills are desiredGood communicator, able to create good relationships and work harmoniously with peopleCommitted, persistent, and curiousAvailability to work on shiftsPosition location
Job location: Europe, Italy, Catania
Education level required: 3 - Upper secondary education diplomaExperience level required: Less than 2 yearsLanguages:Italian (3 - Advanced)English (1 - Basic)Desired start date: 28/02/2024
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