OUR STORY At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society.
We are a global semiconductor company, and our advanced technology chips forms the hidden part of the world we live in today.
When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators makers of technology around the world!
Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect.
People with passion and desire to disrupt the status quo, push boundaries and drive innovation – whilst unlocking your own potential.
Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way.
Our technology starts with you.
Join us and start the future!YOUR ROLE As part of BEMT (Back End Manufacturing Technology), the Package RD is in charge of developing new packages for integrated circuits and related assembly technologies; within Package RD Team, the package designer has the responsibility to design a new package and lead its development from technical viewpoint in cooperation with other Package RD functions.
With the goal to reinforce the team dedicated to QFN package platform, we are looking for a dynamic engineer whose responsibilities will include: Design the new requested package according to the established design rules to fulfill the customer's requirements in term of quality, timing and cost.
Act as Technical Project Leader leading the technical project content in coordination with the assigned Program Manager.
Work in synergy with: Technology Engineering team for package materials selection and the development or validation of assembly technologies.
Material Characterization Measurement Lab for package related stress test, package characterization and relevant measurements Interface with internal external customer, assembly plants and central functions during the project execution through the maturity steps of package development process from feasibility to release to production.
Attend and drive on regular basis meetings/calls to update the stakeholders about the project progress YOUR SKILLS EXPERIENCES Bachelor/Master degree in Mechanical Engineering or similar Proficiency in the use of Autodesk AutoCAD and Inventor Proficiency in the use of Microsoft Office suite Excellent problem-solving and analytical skills Strong communication and teamwork abilities Good attitude to interpersonal relationship Ability to manage multiple tasks and prioritize effectively in a dynamic environment Previous experience in similar role is a plus Knowledge of semiconductor packaging is a plus Fluent in English We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning.
Diversity, Equity and Inclusion (DEI) is part of our company culture.
Our DEI vision is, "At ST, you can be the true version of yourself", we value all employee contributions and have zero tolerance for any kind of discrimination.
Joining us is also about a greater work-life balance and workplace with equal opportunities.
Dedicated Employee Resource Groups for women and LGBTQIA+, hybrid work arrangements are amongst the many DEI Sustainability initiatives that make us a great place to evolve your career.
To discover more, visit st.com/careers #J-18808-Ljbffr