Working in clean room environment to improve, implement, enhance, and develop production process flows for optoelectronic devices' assembly steps. Analyze and enhance current optoelectronic assembly/packaging techniques. Support new components and new products' introduction from design to manufacturing steps. Optimize process parameters, to improve process yield, throughput, and reliability. Implement process controls and quality assurance measures to ensure consistent and reliable process results, such as establishing control plans, process instructions, and inspection criteria. Responsible for troubleshooting for manufacturing and engineering problems related to optoelectronic device assembly/packaging steps. Collaborate with cross-functional teams, including design engineers, supply chain, and manufacturing personnel. Job Requirements: Bachelor's degree (or higher) in engineering, optics, electronics, semiconductors, telecommunication, or equivalent technical discipline. 5 years of working experience in the semiconductor industry, particularly in semiconductors with optoelectronic assembly/packaging. Ability to analyze assembly/packaging process flows and work to improve them through experiments, research, and failure analysis, equipment knowledge. Ability to work within a cleanroom environment. CAD/SolidWorks design knowledge is a plus. Knowledge of process/product validation procedures and techniques. Knowledge of basic six sigma/lean manufacturing concepts like capability studies and SPC. Application of process and product FMEA, problem-solving techniques, risk analysis. Competent with Microsoft Office applications and Minitab. Fluent English is preferred. What We Offer: Dynamic work team. Professional growth. Opportunity to work in an international team environment and interaction with all functions and teams. J-18808-Ljbffr