Lead Engineer/Field Service Engineer

Responsibilities:International and Domestic travel to FABS in Italy and Germany.Responsible for all on-site installations, startup, diagnosis, service, and repair of semiconductor capital equipment.Troubleshoot and repair complex electronic, computer, robotic, and mechanical subsystems.Interface with technical support, design engineering, and manufacturing engineering.Complete standard documentation, procedures, and forms, and comply with standards related procedures and processes.Follow all established cleanroom cleanliness requirements, procedures, and protocols.Qualification: Associates' degree in electronics or 4-6 years of military electronics training and 4 to 6 years of related experience or equivalent combination of education and experience.
#J-18808-Ljbffr